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China wafer probe materials Manufacturers Factory Suppliers

Since the foundation, we have established the market position for the production of high quality platinum probe materials, semiconductor test probe materials, probe wire materials, and strive for excellence in selecting materials and accessories for the process of each production process. We hope to become a modern manufacturer and supplier of the wafer probe materials with grand scale, standardized management, advanced technology, strong strength and sustainable development. We always insist on taking integrity as the foundation of establishment, and take the concept of integrity as the important content of enterprise culture and enterprise management. We have always pursued the service tenet of 'Serving users with heart', constantly introducing new equipment and new technologies, developing and launching more and better products to meet the various needs of customers. We take social responsibility as our honor and enhancing our economic strength as our purpose. In order to fulfill our mission, we integrate advanced technologies at home and abroad to create products that meet customer requirements. We have the strength and ability to help you make reasonable plans according to your needs and actual production situation, and provide you with more economical and reasonable types of products and solutions.
Palladium-based Alloy Wire
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Palladium-based Alloy Wire

With excellent conductivity, wear resistance, and high rebound durability, it is suitable for wafer needle testing and packaging testing.. . The Palladium-based Alloy Wire is a high-performance
Conducting Adhesive
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Conducting Adhesive

Low-temperature curing, strong adhesion, excellent electrical and thermal conductivity. . Electrically Conductive Adhesives (ECA) are specialized electronic adhesives that combine bonding and
Gold Paste
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Gold Paste

With low resistance and high thermal conductivity, it provides high-precision, highly reliable precious metal thick-film interconnects for advanced electronic devices.. . Gold paste is a precious
Platinum Paste
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Platinum Paste

High-platinum oil-based conductive paste with excellent printing uniformity and mass production reproducibility. . Platinum Conductive Paste (Pt Paste) is an ultra-high purity material.. The platinum
Ruthenium Target
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Ruthenium Target

Antioxidant, corrosion-resistant, and uniformly film-forming, providing a highly reliable thin-film deposition solution for semiconductor and data storage applications.. . The ruthenium sputtering
Platinum Target
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Platinum Target

High-purity, dense, and uniformly film-forming, providing highly stable and high-temperature-resistant thin film deposition solutions for semiconductor and medical devices.. . The Platinum Sputtering
High-purity Gold Target
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High-purity Gold Target

High density and exceptional film formation uniformity support various custom shapes and backplate bonding services.. . High-purity gold targets are precious metal sputtering targets fabricated from
Gold-Silicon Alloy
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Gold-Silicon Alloy

Adapted to diverse packaging processes, featuring clean vacuum performance and stable deposition/welding rates.. . The gold-silicon alloy (AuSi) is a binary precious metal alloy primarily composed of
Gold-Tin Alloy
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Gold-Tin Alloy

Stable bonding strength, reliable air-tight sealing performance, and excellent thermal conductivity efficiency.. . The gold-tin alloy (AuSn) is a premium eutectic precious metal material widely used
Gold-Germanium Alloy
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Gold-Germanium Alloy

Excellence in electrical and thermal conductivity efficiency, superior thermal compatibility, and long-term environmental reliability performance.. . The gold-germanium alloy is a
High-purity Gold
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High-purity Gold

Uniform grain structure, extremely low sputtered particles, and stable deposition rate. . High-purity gold serves as a critical source material in semiconductor thin film deposition and
Gold Bonding Wire
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Gold Bonding Wire

Ultra-high purity, excellent conductivity, good ductility, and reliable bonding performance. . Gold Bonding Wire is a precious metal bonding wire fabricated from high-purity gold through precision
Platinum-based Alloy Wire
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Platinum-based Alloy Wire

With excellent conductivity, wear resistance, and high rebound durability, it is suitable for wafer needle testing and packaging testing.. . Platinum-based alloy wires are precious metal filaments
Palladium Alloy Shaped Ribbon
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Palladium Alloy Shaped Ribbon

Antioxidant, wear-resistant, and low contact resistance. Supports precision custom shaping for high-reliability electronic interconnects.. . The Palladium Alloy Shaped Ribbon is a functional alloy
Solder Balls
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Solder Balls

High-precision molding with exceptional consistency. Specifically designed for advanced packaging, it enables high-density and highly reliable electronic interconnects.. . Solder Balls (also known as
Solder Columns
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Solder Columns

Specifically designed for high-density packaging, it combines excellent thermal and electrical conductivity with stress-relief performance, ensuring stable interconnection of large-size devices.. .
Silver-based Solder
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Silver-based Solder

With excellent mechanical properties and chemical stability, it provides high-strength and corrosion-resistant welding performance under complex operating conditions.. . Silver-based solder is a
Nano-silver Solder Paste
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Nano-silver Solder Paste

Delivering bulk-silver thermal performance and superior processability, engineered for high-end semiconductor packaging and power device interconnects.. . Nano-silver solder paste is a
Solder Paste
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Solder Paste

Specifically designed for semiconductor packaging, it enables precision welding with minimal voids and high air tightness.. . The solder paste is formulated by mixing precious metal alloy powders,
Solder Preform Frames
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Solder Preform Frames

Adapted to diverse packaging processes, featuring clean vacuum performance and stable deposition/welding rates. . The solder frame is a specialized precious metal pre-formed frame component designed
Gold-Tin Solder Strips
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Gold-Tin Solder Strips

Core Material for High-Reliability Hermetic Packaging. . Gold-tin solder strips (gold-tin alloy bonding materials) are high-end precious metal brazing materials designed for high-seal,
Gail Jensen star star star star star
The company has always adhered to the original design, worked hard to update products, and assisted new and old customers to quickly solve all kinds of unresolved problems.
Evelyn Kinsey star star star star star
You have very strict control over your products, and I think you get what you pay for, and your products are worth the high price we paid for them.
Robert Leblanc star star star star star
The buyer's delivery speed was very fast, and we got the product very quickly, and the packaging was very good and there was no damage.
Mercy Williams star star star star star
Our order is very urgent, and this manufacturer has continuously produced for us, which has greatly reduced the cost for us and won the trust of customers.
Gwendolyn Mabe star star star star star
You are an extremely good supplier and have first-class equipment and advanced technology.
Donna Watson star star star star star
This product is very easy to use, and I will continue to buy your products next time. By the way, your staff is super responsible, and we like to cooperate with you! !
Our company has a professional team that has been engaged in the alumina wafer chucks, high purity technical ceramics, precious metal conductive materials industry for many years. It can provide a professional and personalized one-stop overall solution according to the actual needs of users, and meet the needs of users to the greatest extent. Provide the best cost-effective products to enable users to obtain benefits. As one of the most professional wafer probe materials manufacturers and suppliers, we also support custom service and OEM service. Please feel free to buy high quality wafer probe materials at competitive price from our factory. Welcome to view our website for more information.

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