Who We Are?
Tessvida is an experienced total process kits solutions (TKS) provider for IC, Pan-semiconductor, New energy and more leading industries. We keep integrating and enlarging our R&D and manufacturing capabilities with experts from advanced materials, fine machining and surface treatment, to provide solutions from product to service. We are placed on a trajectory of being a one-stop-mart to meet your esteemed demands and developing goals. Our competitive TKS are including but not limited to:
Spare parts, HTCC ceramic packaging, Precious metal materials
Precision cleaning & surface treatment
R&D, Design, Prototype, and Mass-manufacturing
After sales & sustaining support
As a continued growing reliable partner of advanced manufacturing areas, Tessvida continues to make substantial investment in developing strategic supplier, key technologies, manufacturing capacity, and more comprehensive solutions to keep supporting and impelling your solid developing, enabling you to create values and shape the future of technologies, by one-stop.


Materials
Advanced Ceramics:
- Alumina, Yttrium Oxide, Zirconia, Aluminum Nitride, Silicon Nitride, Boron Nitride, Silicon Carbide, Porous Ceramics.
- High-Reliability Packaging: HTCC Ceramic Packaging Shells.
Non-Metallics: Quartz, Sapphire, Graphite, Silicon, Teflon, Poly Tetra Fluoroethylene, Polypropylene, Polyformaldehyde, Polyphenylene Sulfide, Poly (Ether-Ether-Ketone), etc.
Metals & Precious Metals:
- Structural & Functional Metals: Aluminum, Titanium, Stainless Steel, Alloys, etc.
- High-Purity & Precious Metals: A full portfolio for critical processes, including semiconductor packaging materials, solders, bonding wires, evaporation materials, targets, and conductive pastes.
Value-Added Services: Customization, Assembly, Integration.
Manufacturing Process
Material Preparing: Raw Materials Preparation, Spray Granulation (Mix Raw Material, Ball-milling, Synthesis, Spray Drying)
Green body Shaping: HIP, CIP, Dry Pressing, Injection Molding, Gel-forming, Tape-casting, Hot Pressing Molding.
Sintering: Normal Pressure Sintering, Vacuum Sintering, Gas Pressure Sintering
Fine Machining: Cutting, Turning, Grinding, Milling, Paring, Drilling.
Surface Treatment: Ultra-clean Cleaning, Texturing, Arc Spraying, Plasma Spraying, Electrostatic Spraying, Vapor Deposition, Anodizing, Electro-plating, Surface Metallization


