Precious Metals
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Conducting Adhesive
Low-temperature curing, strong adhesion, excellent electrical and thermal conductivity. . Electrically Conductive Adhesives (ECA) are specialized electronic adhesives that combine bonding and
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Gold Paste
With low resistance and high thermal conductivity, it provides high-precision, highly reliable precious metal thick-film interconnects for advanced electronic devices.. . Gold paste is a precious
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Platinum Paste
High-platinum oil-based conductive paste with excellent printing uniformity and mass production reproducibility. . Platinum Conductive Paste (Pt Paste) is an ultra-high purity material.. The platinum
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Ruthenium Target
Antioxidant, corrosion-resistant, and uniformly film-forming, providing a highly reliable thin-film deposition solution for semiconductor and data storage applications.. . The ruthenium sputtering
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Platinum Target
High-purity, dense, and uniformly film-forming, providing highly stable and high-temperature-resistant thin film deposition solutions for semiconductor and medical devices.. . The Platinum Sputtering
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High-purity Gold Target
High density and exceptional film formation uniformity support various custom shapes and backplate bonding services.. . High-purity gold targets are precious metal sputtering targets fabricated from
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Gold-Silicon Alloy
Adapted to diverse packaging processes, featuring clean vacuum performance and stable deposition/welding rates.. . The gold-silicon alloy (AuSi) is a binary precious metal alloy primarily composed of
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Gold-Tin Alloy
Stable bonding strength, reliable air-tight sealing performance, and excellent thermal conductivity efficiency.. . The gold-tin alloy (AuSn) is a premium eutectic precious metal material widely used
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Gold-Germanium Alloy
Excellence in electrical and thermal conductivity efficiency, superior thermal compatibility, and long-term environmental reliability performance.. . The gold-germanium alloy is a
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High-purity Gold
Uniform grain structure, extremely low sputtered particles, and stable deposition rate. . High-purity gold serves as a critical source material in semiconductor thin film deposition and
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Gold Bonding Wire
Ultra-high purity, excellent conductivity, good ductility, and reliable bonding performance. . Gold Bonding Wire is a precious metal bonding wire fabricated from high-purity gold through precision
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Platinum-based Alloy Wire
With excellent conductivity, wear resistance, and high rebound durability, it is suitable for wafer needle testing and packaging testing.. . Platinum-based alloy wires are precious metal filaments
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Palladium-based Alloy Wire
With excellent conductivity, wear resistance, and high rebound durability, it is suitable for wafer needle testing and packaging testing.. . The Palladium-based Alloy Wire is a high-performance
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Palladium Alloy Shaped Ribbon
Antioxidant, wear-resistant, and low contact resistance. Supports precision custom shaping for high-reliability electronic interconnects.. . The Palladium Alloy Shaped Ribbon is a functional alloy
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Solder Balls
High-precision molding with exceptional consistency. Specifically designed for advanced packaging, it enables high-density and highly reliable electronic interconnects.. . Solder Balls (also known as
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Solder Columns
Specifically designed for high-density packaging, it combines excellent thermal and electrical conductivity with stress-relief performance, ensuring stable interconnection of large-size devices.. .
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Silver-based Solder
With excellent mechanical properties and chemical stability, it provides high-strength and corrosion-resistant welding performance under complex operating conditions.. . Silver-based solder is a
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Nano-silver Solder Paste
Delivering bulk-silver thermal performance and superior processability, engineered for high-end semiconductor packaging and power device interconnects.. . Nano-silver solder paste is a
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Solder Paste
Specifically designed for semiconductor packaging, it enables precision welding with minimal voids and high air tightness.. . The solder paste is formulated by mixing precious metal alloy powders,
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Solder Preform Frames
Adapted to diverse packaging processes, featuring clean vacuum performance and stable deposition/welding rates. . The solder frame is a specialized precious metal pre-formed frame component designed
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Gold-Tin Solder Strips
Core Material for High-Reliability Hermetic Packaging. . Gold-tin solder strips (gold-tin alloy bonding materials) are high-end precious metal brazing materials designed for high-seal,
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