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Ceramic Dome
High-purity, dense materials offering superior plasma resistance and lasting stability.. . Dome ceramic products are characterized by high hardness, excellent wear resistance, good corrosion
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Alumina Ceramic Arm
Heat-resistant, wear-resistant, suitable for material handling and transportation.. . The ceramic end effector is specifically developed for precision material handling requirements. Utilizing
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Porous Ceramic Plates
High-precision porous ceramic plates with high temp resistance, corrosion resistance and stable adsorption for semiconductors.. . Porous ceramic plates are new porous ceramic materials made from
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Ceramic Air Bearing Stages
High-purity alumina ceramic offers heat/wear resistance and high flatness for precise movement.. . Ceramic air bearing stages, crafted from high-purity alumina ceramic, form a uniform, stable air
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Vacuum Wafer Chucks
High flatness, uniform adsorption, chemical resistance, for clean transfer.. . Ceramic vacuum wafer chucks are widely used as fixture tools in the wafer thinning and cutting processes within the
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Ceramic Rings
High-purity ceramics with good plasma resistance and low deformation for stable etching processes.. . We offer various types of customized processing for ceramic rings, such as etching rings,
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Ceramic Disc
Good rigidity, wear and chemical corrosion resistance. Features uniform heat distribution with minimal deformation.. . Crafted from advanced materials such as high-purity alumina, zirconia, or
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Custom Ceramic Packages
Bespoke HTCC multilayer solutions tailored to specific structural and routing requirements.. . We offer a range of high-quality, reliable special and irregular ceramic components, such as: irregular
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Insulator Rings
High-insulation ceramic material withstands high voltage and temperatures.. . Ceramic insulation rings serve as critical isolation parts in semiconductor process chambers. These rings provide
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Gold-Tin Alloy Lid
Flux-free, vacuum-tight sealing lids that significantly enhance long-term system stability.. . Gold-tin alloy solder lids are key components for achieving airtight encapsulation of electronic
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Precious Metal Pastes
Precious Metal Pastes offer functional conductive material solutions for the electronics and microelectronics industries. This portfolio primarily consists of platinum paste, gold paste, and
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Sputtering Targets
Sputtering targets are used in physical vapor deposition (PVD) processes for thin film fabrication. The portfolio includes high-purity gold targets, platinum targets, and ruthenium targets,
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Bonding & Evaporation
Bonding & Evaporation materials are designed for semiconductor interconnection and thin film deposition processes. The portfolio includes gold bonding wires, high-purity gold materials, AuGe alloys,
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Probe Pin Materials
Probe Materials offer precious metal wire solutions engineered for semiconductor testing and precision sensing applications. Comprising Palladium and Platinum-based alloy systems, these materials are
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Electrode Materials
Electrode materials provide precious metal and alloy-based solutions for electrical contact and interconnection applications. The portfolio is centered on palladium alloy systems, offering balanced
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Packaging Materials
Packaging materials provide brazing and interconnection solutions for precision electronic assembly. The product range includes AuSn solder preforms, solder frames, solder pastes, nano-silver pastes,
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Conducting Adhesive
Low-temperature curing, strong adhesion, excellent electrical and thermal conductivity. . Electrically Conductive Adhesives (ECA) are specialized electronic adhesives that combine bonding and
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Gold Paste
With low resistance and high thermal conductivity, it provides high-precision, highly reliable precious metal thick-film interconnects for advanced electronic devices.. . Gold paste is a precious
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Platinum Paste
High-platinum oil-based conductive paste with excellent printing uniformity and mass production reproducibility. . Platinum Conductive Paste (Pt Paste) is an ultra-high purity material.. The platinum
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Ruthenium Target
Antioxidant, corrosion-resistant, and uniformly film-forming, providing a highly reliable thin-film deposition solution for semiconductor and data storage applications.. . The ruthenium sputtering
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Platinum Target
High-purity, dense, and uniformly film-forming, providing highly stable and high-temperature-resistant thin film deposition solutions for semiconductor and medical devices.. . The Platinum Sputtering
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High-purity Gold Target
High density and exceptional film formation uniformity support various custom shapes and backplate bonding services.. . High-purity gold targets are precious metal sputtering targets fabricated from
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Gold-Silicon Alloy
Adapted to diverse packaging processes, featuring clean vacuum performance and stable deposition/welding rates.. . The gold-silicon alloy (AuSi) is a binary precious metal alloy primarily composed of
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Gold-Tin Alloy
Stable bonding strength, reliable air-tight sealing performance, and excellent thermal conductivity efficiency.. . The gold-tin alloy (AuSn) is a premium eutectic precious metal material widely used
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