Product Description
This series of conductive adhesives utilizes epoxy resin, acrylic resin, silicone resin, and other matrix resins, filled with precious metals or conductive powders to form a conductive network. The products eliminate the need for high-temperature reflow soldering, leave no flux residue, and simplify the manufacturing process. They enable chip bonding, PCB interconnection, flexible circuit connections, EMI shielding, and electrostatic discharge, providing long-term reliable conductive and structural bonding for precision electronics and thermosensitive device assembly.
Feature
- Low-temperature curing/drying: Protects heat-sensitive components.
- Solder alternative: Resolves high-temperature soldering issues for heat-sensitive devices.
- High bonding strength: Compatible with metals, ceramics, PCBs, and flexible substrates.
- Excellent rheological properties.
- Dual-functional: Provides both electrical and thermal conductivity.
- EMI/RFI shielding & Anti-static: Select models offer electromagnetic/radio-frequency interference shielding and ESD protection.
- Flexible curing options: Supports various curing methods and processes.
Application
- Automotive Electronics: ADAS Radar/Lidar/Camera Module Adhesive
- Medical Electronics: Implantable Devices, Precision Sensors, Flexible Electrode Interconnects
- Consumer Electronics: Internal component mounting for smartphones, watches, and handheld devices
- Display and Touch: LCD, OLED, Touchscreen Circuit Connection
- Semiconductors: Die bonding, flip-chip interconnects, MEMS packaging
- Shielding and Anti-static: EMI/RFI Shielding, Grounding, and Anti-static Structure
Customized Service
For customizations regarding gold content, viscosity, specifications, samples, or quotes, please feel free to contact us. We can provide tailored material and process solutions based on your specific requirements.
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