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Precision Cleaning & Surface Treatment

We specialize in providing professional cleaning and surface treatment solutions for advanced process technologies. By integrating resources from strategic partners within the industry, we collaborate to deliver comprehensive service support to our customers. Our partners possess over 20 years of practical experience in the semiconductor field, with teams equipped with technical expertise covering down to the 14nm node. They are capable of reliably providing cleaning and surface treatment services for 8-inch and 12-inch wafer fabs, encompassing processes such as Physical Vapor Deposition (PVD), Chemical Vapor Deposition (CVD), Etching, and Ion Implantation.

Acting as a service bridge, we leverage our partners' mature quality management systems and responsive service capabilities to help integrated circuit and broad semiconductor manufacturing customers address stringent quality control and process challenges, delivering efficient and stable service support.

 

 

Precision Cleaning Case Studies

 

Sample testing after precision washing, the particle level and the level of metal ion residue on the surface must meet the requirements of the current 28nm process.

Electrostatic Chuck
  • page-314-271
    Before
  • page-310-271
    After
ETCH Components
  • page-314-268
    Before
  • page-314-270
    After
Physical Vapor Deposition (PVD)
  • page-309-269
    Before
  • page-309-269
    After
Si Electrode
  • page-315-271
    Before
  • page-315-271
    After

 

 

Precision Cleaning & Reconditioning Process

  • Incoming Inspection

    Incoming Inspection

    Check appearance, specs, and damage.

  • Masking

    Masking

    Protect non-treatment areas from corrosion.

  • Chemical Stripping

    Chemical Stripping

    Precisely remove old coatings.

  • Rinsing/Soaking

    Rinsing/Soaking

    Eliminate chemical residues with pure water.

  • Masking

    Masking

    Shield areas from sandblasting.

  • Sandblasting

    Sandblasting

    Adjust parameters to achieve target roughness.

  • Sizing & Inspection

    Sizing & Inspection

    Measure and correct dimensions to meet spec.

  • Thermal Spraying

    Thermal Spraying

    Apply wear-resistant coatings via Arc or Plasma.

  • High-Pressure Wash

    High-Pressure Wash

    Remove large surface particles.

  • Ultrasonic Cleaning

    Ultrasonic Cleaning

    Perform precision cleaning to remove fine particles.

  • Cleanroom Drying

    Cleanroom Drying

    Dry components thoroughly in a Class 100 cleanroom oven.

  • Final Inspection

    Final Inspection

    Conduct comprehensive checks to ensure compliance.

  • Packaging

    Packaging

    Vacuum pack components per customer requirements.

  • Shipping Audit

    Shipping Audit

    Verify quantity and packaging integrity.

  • Final Delivery

    Final Delivery

    Generate reports and deliver.

 

Service Capability

 

5000m2 (55000 sq. ft.) clean workshop area.

Over 5,0000 pieces/month treatment capability.

365 days of continuous and efficient service.

Different products, different processes.

8 leading processing line including technologies of:

  • Chemical cleaning/stripping, Physical stripping
  • ARC-spray, Plasma spray, Coating, Texturing, Vacuum cleaning and packaging, overhaul, etc.

 

page-750-500

 

 

Technical Capability

 

page-750-500

Process: 14nm advanced process

Service scope: 4 inches, 6 inches, 12 inches of semiconductor parts

Service process: PVD/CVD/ETCH/IMPLANT/LITHO

Strict quality control: High-standard precision cleaning technology