Name: Custom Gold-Tin Alloy Lid Manufacturers Suppliers Factory - OEM Gold-Tin Alloy Lid - Tessvida
Brand: Tessvida
SKU: 299597751

Gold-Tin Alloy Lid

Flux-free, vacuum-tight sealing lids that significantly enhance long-term system stability.

Gold-tin alloy solder lids are key components for achieving airtight encapsulation of electronic devices. This series of lids is uniformly coated with Au80Sn20 gold-tin alloy solder and nickel-gold plating, specifically designed for microwave devices, precision sensors, MEMS components, and various high-performance logic modules that require high-reliability protection. The advantage lies in the small encapsulation stress and high sealing strength, providing a long-term stable dust-free, dry working environment for the internal core units, especially when facing harsh working conditions, still demonstrating good protective capabilities.

Available materials: Kovar alloy, iron-nickel-cobalt alloy, copper-tungsten, molybdenum-copper, eutectic alloy.
Application: Semiconductor & Electronics, Medical Devices, Energy & Power, Equipment & Machinery, Petrol & Chemical.

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Product Description

We have nearly 500 types of ready-made gold-tin alloy solder cover plate types, with the smallest size down to 2.40mm and the solder width as narrow as 0.35mm, precisely fitting various high-density packaging needs. The product uses Au80Sn20 eutectic solder, with small sealing stress and excellent air tightness, ensuring long-term stability of internal components even in harsh environments. Relying on a rich stock of base materials such as Kovar and copper-tungsten, we can complete precise specification matching based on actual needs, conduct technical adaptation for existing packaging samples, ensure the cover plate and shell process compatibility, and achieve rapid supply.

Features

Low thermal stress
High hermeticity and long-term stability
Radiation resistance and aging resistance
Supports multifunctional integration design
Compatible with automated packaging production lines
High electrical insulation performance

Low resistivity
Good corrosion resistance
High moisture resistance
High electromagnetic interference (EMI) resistance
Low coefficient of thermal expansion (CTE)

Main Model Table (mm)

Gold-Tin (AuSn) alloy lids are available in various substrates including Kovar, CuW, and MoCu, with flexible options for thickness and solder preform layouts. Leveraging our extensive standard inventory and mature selection system.

Ceramic Expertise

Tessvida is a Total Kit Solutions (TKS) specialist, serving key industries: semiconductor & electronics, medical devices, FPD/LED, machinery, petrochemicals, auto & Transportation, energy & power, and food & agriculture. With a mature supply chain and advanced processes (isostatic pressing, gel casting, dry pressing), we offer end-to-end capabilities from material preparation, molding, sintering to precision machining and post-processing.

Backed by deep expertise in high-purity ceramics and strong resource integration, our flexible custom services precisely meet customer needs from material selection to finished product delivery.