Product Description

The product is manufactured from high-purity precious metal alloy substrates using precision molding techniques, featuring a customized frame structure that accommodates the dimensions and connection requirements of various packaging substrates such as ceramics, metallized substrates, and Kevlar alloys. It offers precise dimensional control, adjustable solder usage, high welding consistency, and excellent airtight sealing performance, significantly simplifying packaging and assembly processes, reducing manual operational errors, and improving product yield. It is widely applicable to high-end precision packaging applications in fields such as optoelectronics, RF/microwave, semiconductors, and automotive electronics.

Features

The eutectic melting point is stable.
Excellent wettability and fluidity.
The welded joint is dense.
High chemical stability.
Exhibits excellent electrical and thermal conductivity.
The ingredients are homogeneous with excellent batch stability, making it suitable for mass production processes.
Diverse in form, suitable for various processes such as evaporation, bonding, and brazing.

High-precision molding: stringent dimensional tolerances, smooth edges, and reduced welding defects.
Multi-substrate compatibility: Compatible with ceramic, ferroalloy, metallized substrates, etc., ensuring reliable heterogeneous connections.
High air-tight seal: Firmly bonded with excellent thermal resistance, suitable for extreme operating conditions.

Standard preform: Compatible with automated production lines.
Environmental friendliness: Compatible with existing lead-free solder production line processes.
Low thermal stress: Minimal deformation during the welding process, maintaining structural integrity of the packaged component.
Flexible customization: Supports customization of structure, dimensions, composition, and surface treatment.

Specifications and Models

Performance Index	Technical Parameter	Application Instructions
Welding void rate	For more information, please contact customer service.	Effectively ensures airtight sealing performance
Air-tight sealing grade	For more information, please contact customer service.	Meet the high air-tightness requirements of premium components
Operating temperature range	For more information, please contact customer service.	Adapt to extreme temperature variation conditions
Surface treatment method	Natural color / flux coating / electroplated layer	Can be customized according to the welding substrate
Forming process	Precision punching / Laser forming	Ultra-thin/Custom-shaped structures are prioritized for laser forming

Product Advantages

Process Optimization for Efficiency: Eliminates solder mixing and manual coating steps, significantly reducing packaging and assembly procedures.
Yield improvement: Precise and controllable solder usage reduces welding defects such as overflow and voids, thereby enhancing packaging yield.
Stable and reliable: High airtight sealing and high connection strength ensure long-term stable operation of components under extreme operating conditions.
Automation Integration: Standardized structure connects to automated production lines, enabling efficient batch production.
Customization: Full-dimensional customization capabilities to meet the personalized packaging requirements of various components.

Application

The solder frame, as a standardized component for high-end precision packaging, is widely used in various electronic component applications requiring stringent packaging quality due to its high precision, excellent air-tightness, and exceptional reliability. Its primary application scenarios include:

Radio frequency/microwave devices: SAW filters, crystal resonators, microwave/mmWave radar components, RF connectors, high-frequency inductors, etc.
Optoelectronic devices: deep ultraviolet LEDs, semiconductor laser modules, optocoupler devices, SMD diodes, optical communication modules, etc.
Semiconductor Packaging: Various ceramic packaging components, lead frames, lead pins, discrete devices, Hall effect devices, solid-state relays, etc.
Automotive electronic components: high-reliability parts such as vehicle-mounted LiDAR, automotive-grade sensors, automotive electronic control modules, and vehicle-mounted RF components.
Precision Special Devices: Aerospace/military-grade precision electronic components, high-end medical electronic equipment, industrial-grade high-precision sensors, etc.