Product Description
This series of high-purity gold products undergoes rigorous purification and impurity control processes, resulting in minimal impurity content that effectively prevents device performance degradation or packaging failure caused by impurity introduction. Available in forms such as evaporated materials, sputtering targets, gold sheets, and gold particles, these products are compatible with various manufacturing processes including vacuum evaporation, physical vapor deposition (PVD), and electroplating. In applications such as semiconductor bonding, chip interconnects, and thin-film coatings, they form uniform, dense, and high-purity gold layers that meet the stringent requirements for material purity and reliability in high-end devices.
Feature
- Ultra-high purity
- Excellent chemical stability
- Excellent conductivity
- Exhibits excellent ductility and formability, compatible with various manufacturing processes
- High consistency of purity
Specifications and Models
For specific samples or quotes, please contact our customer service. We will provide tailored material solutions based on your packaging process and specific requirements.
| Classification Dimension | Product Type | Core Features |
| Purity grade | Different purity grades | Different purity levels: suitable for general semiconductor evaporation, coating processes, high-end devices, and high-frequency packaging. |
| Product format | High-purity gold evaporation material | Granular/block-shaped, compatible with vacuum evaporation coating equipment. |
| High-purity gold sputtering target material | Plate-like/sheet-like, for physical vapor deposition (PVD) coating. | |
| High-purity gold sheet / bar | Ultra-thin sheet-like, used for chip bonding and precision coating. |
Product Advantages
- Exhibits excellent contact stability with minimal resistance variation during prolonged use.
- Exemplary antioxidant capacity with enhanced reliability under high-temperature conditions.
- Exhibits excellent wear resistance and resistance to micro-abrasion.
- Exhibits excellent ductility and can be processed into various structural profiles with irregular cross-sections.
- Compatible with various processing techniques including roll-to-roll and rack-mounted configurations.
- Can replace part of the gold plating solution, balancing cost and reliability.
- Exhibits excellent weldability and good compatibility with copper substrates and ceramic substrates.
Application
- The contact area between the electronic connector plug and socket
- Communication relay, switch electrical contacts, and spring contacts
- Automotive electronic connectors, conductive components for high-temperature environments
- Sensor electrodes, leads, and sealing support structure
- High-precision electronic packaging internal conductive and connection components
- Precision components requiring oxidation resistance and low contact resistance
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