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Custom Ceramic Packages

Custom Ceramic Packages

Bespoke HTCC multilayer solutions tailored to specific structural and routing requirements.

We offer a range of high-quality, reliable special and irregular ceramic components, such as: irregular casings, connectors, heaters, etc. Among them, the irregular ceramic casing is a precision sealing solution designed for complex spatial layouts. These products meet the non-standard structural requirements of electronic engineering with their high hardness, wear resistance, and outstanding chemical inertness, providing robust physical protection for high-performance logic modules, optoelectronic devices, and hybrid functional units. The casing also features excellent electrical insulation properties and dielectric stability, and has a low coefficient of thermal expansion, maintaining precise structural form and air-tight reliability even under severe temperature fluctuations or high humidity environments, supporting the long-term stable operation of internal core components.

Available materials: alumina, aluminum nitride, zirconia, silicon carbide, piezoelectric ceramic, Kovar alloy, stainless steel inserts.
Applications: Semiconductor & Electronics, Medical Devices, Energy & Power, Equipment & Machinery, Petrol & Chemical, FPD/LED.
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Product Introduction

Product Description

 

We can overcome structural support and supply reliability challenges under harsh conditions, relying on high-quality production resources and mature thick-film metallization technology to create custom ceramic components that have excellent resistance to chemical corrosion and mechanical shock. We have flexible customized solution support capabilities that can achieve multi-dimensional functional integration, helping customers achieve the ideal balance between electromagnetic compatibility and thermal management. Whether you have design drawings or only provide physical samples, we can provide professional support solutions to ensure that the supporting components are accurately implemented and efficiently matched.

 

 

Features

  • Strong environmental adaptability
  • Excellent electrical insulation and dielectric stability
  • Outstanding chemical inertness
  • High hardness and wear resistance
  • Supports multifunctional integration design
  • Good biocompatibility
  • Low resistivity
  • High moisture resistance
  • High electromagnetic interference (EMI) resistance
  • Low coefficient of thermal expansion (CTE)

 

Main Model Table (mm)

 

Custom-shaped ceramic packages are available in Al₂O₃, AlN, ZrO₂, SiC, and piezoelectric ceramics, with optional Kovar or stainless steel inserts. Featuring professional metallization for reliable bonding strength, we offer full-scale customization based on your drawings and provide technical support for sample-to-production conversion.

 

Product Model

Ceramic Body Size

Lead Pitch

Sealing Area

Die Attach Area

Total Thickness

CDIL08-01

9.70×7.40

2.54

3.35×5.40

Apply D06S2-03

2.00

 

 

Ceramic Expertise

 

Tessvida is a Total Kit Solutions (TKS) specialist, serving key industries: semiconductor & electronics, medical devices, FPD/LED, machinery, petrochemicals, auto & Transportation, energy & power, and food & agriculture. With a mature supply chain and advanced processes (isostatic pressing, gel casting, dry pressing), we offer end-to-end capabilities from material preparation, molding, sintering to precision machining and post-processing.

Backed by deep expertise in high-purity ceramics and strong resource integration, our flexible custom services precisely meet customer needs from material selection to finished product delivery.

 

 

Ceramic Production Process

 

High-Temperature

Powder Preparation

Raw material powder preparation, spray granulation (mixing, mechanical ball milling, spray drying)

01

Powder Forming

Powder Forming

Isostatic pressing, dry pressing, injection molding, gel forming, casting, hot pressing

02

Powder Preparation

High-Temperature Sintering

Atmospheric sintering, vacuum sintering, controlled atmosphere sintering

03

Precision Processing

Precision Processing

Cutting, turning, grinding, milling, shaping, drilling

04

Surface Treatment

Surface Treatment

Cleaning, arc melting, plasma spraying, electrostatic spraying, vapor deposition, ultra-clean cleaning, anodizing, metallization composite

05

 

 

Precision Ceramic Processing Workflow

 

  • Material Preparation

    Material Preparation

  • Material Forming

    Material Forming

  • Sintering

    Sintering

  • Fine Machining

    Fine Machining

  • Inspection

    Inspection

  • Precision Cleaning

    Precision Cleaning

  • Vacuum Packing

    Vacuum Packing

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    Material Preparation

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    Material Forming

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    Sintering

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    Fine Machining

  • wmpage05-s1.webp

    Inspection

  • wmpage06-s1.webp

    Precision Cleaning

  • wmpage06-s1.webp

    Vacuum Packing

 

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