Ceramic materials are essential in the modern semiconductor industry due to their unique properties. Commonly used advanced materials in semiconductor applications include oxides, nitrides, silicon carbide, ceramic composites, metals, and alloys, driving innovation in technology.
As an experienced total process kits solutions (TKS) provider, Tessvida supplies a full range of process kits and materials, supported by a global network of high-quality suppliers. Our end-to-end supply chain covers everything from material selection to final product delivery, ensuring consistent performance and reliability. We provide various ceramic products along with precision cleaning, surface treatment, and technical services to leading wafer fabs and equipment manufacturers. All products are fully validated in real semiconductor manufacturing environments.
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Ceramic Insulating Rings
Ceramic chambers and domes
Ceramic Discs
Good rigidity, wear and chemical corrosion resistance. Features uniform heat distribution with minimal deformation.
Ceramic Chamber Lids
Ceramic Package
Provides engineering support for nearly 1,000 ceramic packages & lids covering CDIP, CPGA, CFP, CLGA, CQFP, CSOP, CDFN, CLCC, SMD series.
Ceramic Dual In-line Package
Gold-Tin Alloy Lid
Flux-free, vacuum-tight sealing lids that significantly enhance long-term system stability.
SMD Package
Robust multilayer surface-mount structures supporting automated assembly with superior integrity.
Advanced Ceramics for the Semiconductor Industry
In the semiconductor industry, spanning the front-end processes of silicon wafer preparation, precise lithography, and etching, to the back-end stages of chip packaging and integrated material handling, our high-performance ceramic components are engineered to ensure your manufacturing processes are efficient and stable. Tessvida is committed to providing you with the most suitable advanced materials tailored to your specific needs.
● Advanced Ceramic Materials：Al₂O₃(Up to 99.7%), AlN, SiC, Si₃N₄, ZrO₂, Porous
● Metals and Alloys：Aluminum & alloy, Magnesium & Alloys, Stainless steel, Titanium & alloy
● Non-metal materials：PP, POM, PPS, PCTFE, ULTEM, PTFE, PC, MC, Quartz, Sapphire, Silicon
Products can be customized according to drawings and samples to meet your actual needs.
Support & Services
- Integrated parts manufacturing/refurbishing
- Materials, Structure customization
- Cooperation at designing, application and cost-control
- After-sale service and Product application tracking
- Precision cleaning of brand new and used parts
- Bead blasting and other surface treatment
- Cooperate at designing, application and cost-control
- Integrated parts manufacturing and high yield capability
- Genuine after-sale service and product application tracking
Material Forming
Isostatic pressing, dry pressing, or injection molding to achieve complex shapes and high density.
CNC Grinding and Milling
CNC milling, turning, and grinding with micron-level precision.
Fine Machining
Surface polishing for smooth finishes and optical-grade surface quality.
Precision Cleaning
Ultrasonic and chemical cleaning processes to ensure residue-free surfaces.
Manufacturing Expertise
Advanced Ceramics
Advanced ceramics materials at Oxide, Nitride, Carbide, compound areas.
Core Processing
Advanced processing technologies at Isostatic pressing, injection, coating, vapor deposition, casting, etc.
Ultra-Precision Machining
Ultra-precision machining with extreme shape and dimensional accuracy.
IC Precision Cleaning
Precision cleaning technology for advanced process nodes in IC industry.
Surface Treatment
Precision surface treatment of key chamber parts.
Design & Prototyping
Structure and function designing, prototyping and demonstration.
Expertise in Advanced Ceramics
