Name: Ceramic Packages and SMD Package Manufacturers, Suppliers and Factory - Custom Service - Tessvida
Brand: Tessvida
SKU: 299598259

Ceramic Packages and SMD Package

Robust multilayer surface-mount structures supporting automated assembly with superior integrity.

SMD (Surface Mounted Device) enclosures are important packaging carriers for modern medium and high-power electronic and electrical components. Cleverly combining the high insulation of ceramic materials with the high thermal conductivity of metal materials, they can adapt to the packaging needs of various power level diodes and control modules, providing them with solid physical support and professional thermal management solutions. The products are compact in size, convenient for automatic mounting, and through precise tungsten-manganese thick film metallization and nickel-gold plating process, the reliability of welding and bonding is improved. Facing high standards such as high-power silicon-aluminum wire bonding, they can also maintain good connection strength and stability, helping the core power unit to operate stably under complex conditions.

Available materials: alumina, aluminum nitride, tungsten-copper, molybdenum-copper, oxygen-free copper, tungsten-manganese thick film metallization.
Application: Semiconductor & Electronics, Medical Devices, Energy & Power, Equipment & Machinery, Petrol & Chemical

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Product Description

The core advantage of the SMD shells we supply is reflected in the efficiency of heat conduction and current carrying capacity. By optimizing the material scheme of the heat dissipation base, the product helps alleviate the temperature rise pressure of power components under high load. The metallized layer of the shell has stable quality, good conductivity and low resistivity characteristics, and has excellent resistance to environmental aging. We have a rich selection of standard specifications available for selection, and can also carry out professional technical matching for special application scenarios, providing material solutions with high adaptability, helping to stabilize the packaging production line.

Features

Excellent heat dissipation performance
Strong resistance to environmental aging and long service life
Good electromagnetic compatibility (EMC)
Supports high current-carrying capacity
Strong long-term service stability

Excellent electrical performance
Good corrosion resistance
High impact resistance
Low coefficient of thermal expansion (CTE)
High moisture resistance

Main Model Table (mm)

SMD packages feature Alumina or AlN substrates with heat sink options in CuW, MoCu, or OFC. We offer full-scale customization with precise material cross-referencing and technical conversion from drawings or physical samples to accurately match diverse and specialized component requirements.

Ceramic Expertise

Tessvida is a Total Kit Solutions (TKS) specialist, serving key industries: semiconductor & electronics, medical devices, FPD/LED, machinery, petrochemicals, auto & Transportation, energy & power, and food & agriculture. With a mature supply chain and advanced processes (isostatic pressing, gel casting, dry pressing), we offer end-to-end capabilities from material preparation, molding, sintering to precision machining and post-processing.

Backed by deep expertise in high-purity ceramics and strong resource integration, our flexible custom services precisely meet customer needs from material selection to finished product delivery.