Name: Ceramic Dual In-line Package (CDIP) Manufacturers, Suppliers and Factory - Custom Service - Tessvida
Brand: Tessvida
SKU: 299596207

Product Description

The dual-row ceramic through-hole package is engineered for high-end semiconductor applications, delivering superior gas-tight protection and thermal regulation. By integrating high-efficiency heat sinks with parallel seam welding or alloy solder sealing technologies, it creates a stable environment that shields critical internal modules from external interference. Utilizing advanced multilayer ceramic sintering processes, we ensure high-reliability operation of electronic components. With flexible material options and sealing methods, this package provides a one-stop solution for signal processing and power control in complex environments.

Features

High gas tightness
Excellent thermal stability
Superior high-frequency performance
Heat and corrosion resistance
Strong radiation resistance

Integrated heat sink design capability
Low resistivity
High insulation performance
High hardness and impact resistance
High moisture resistance

Main Model Table (mm)

CDIP packaging features a 2.54mm pitch with pin counts to 64, offering narrow (7.62mm), medium (10.16mm), and wide (15.24mm) spans. Options include integrated heat sinks and sealing methods via parallel seam welding or alloy solder reflow, widely used for ICs, optocouplers, and MEMS requiring high reliability.

Product Model	Ceramic Body Size	Lead Pitch	Sealing Area	Die Attach Area	Total Thickness
D48L2-01	60.96×15.00	2.54	12.70×12.70	8.89×8.89	2.40
D40L2-01	50.80×15.00	2.54	12.70×12.70	7.87×7.87	2.40
HD36-01	45.72×14.98	2.54	20.20×8.54	24.70×14.50	2.00
D28S2-03	38.60×7.37	2.54	38.40×7.20	2.10×3.30	3.70
D28S2-01	35.56×7.37	2.54	11.80×7.20	7.11×5.59	2.15
D28L2-01	35.56×15	2.54	12.70×12.70	6.40×6.40	2.50
D24S2-04	30.48×7.37	2.54	11.94×7.36	5.75×3.80	1.75
D24S2-02	33.50×7.37	2.54	32.80×7.10	3.80×2.85	3.50
D24S2-01	30.48×7.37	2.54	14.40×7.20	9.15×4.45	2.16
D24L2-01B	30.48×15.00	2.54	12.70×12.70	6.40×6.40	2.40
D24L2-01	30.48×15.00	2.54	12.70×12.70	6.40×6.40	2.40
D18M2-01	22.86×9.91	2.54	9.40×8.70	5.50×5.00	2.40
D16S2-11	20.60×7.37	2.54	19.20×7.00	3.30×5.00	2.80
D16S2-06	20.32×7.37	2.54	16.60×7.20	2.60×3.20	3.30
D16S2-05	20.00×7.37	2.54	19.60×7.00	3.90×5.40	3.40
D16S2-02/K	20.32×7.37	2.54	11.80×7.20	5.60×3.80	2.10
D16S2-02C	20.32×7.37	2.54	11.80×7.20	5.60×3.80	2.10
D16S2-02B	20.32×7.37	2.54	11.80×7.20	5.60×3.80	2.10
D16S2-02A	20.32×7.37	2.54	11.80×7.20	5.60×3.80	2.10
D16S2-02	20.32×7.37	2.54	11.80×7.20	5.60×3.80	2.10
D08S2-12	9.70×7.37	2.54	7.70×7.00	4.20×5.00	2.10
D08S2-11A	9.70×7.37	2.54	9.30×7.20	2.70×2.50	3.40
D08S2-03B	9.90×7.37	2.54	9.70×7.17	3.55×5.37	3.00
D08S2-03A	9.90×7.37	2.54	9.70×7.17	3.55×5.37	3.00
D08S2-01	10.16×7.37	2.54	8.80×6.90	5.10×3.40	2.10
D08M-04	19.46×9.91	7.62	19.10×8.80	7.60×4.40	3.50
D08M-01A	14.22×10.03	2.54	13.40×9.60	9.60×8.10	30
D06S2-02	9.00×7.37	2.54	7.20×6.20	3.70×3.00	3.10
D06S2-01	9.70×7.37	2.54	9.30×6.90	7.30×3.30	3.50
D04S2-01	4.70×6.60	2.54	6.60×4.70	2.60×3.00	2.90

Ceramic Expertise

Tessvida is a Total Kit Solutions (TKS) specialist, serving key industries: semiconductor & electronics, medical devices, FPD/LED, machinery, petrochemicals, auto & Transportation, energy & power, and food & agriculture. With a mature supply chain and advanced processes (isostatic pressing, gel casting, dry pressing), we offer end-to-end capabilities from material preparation, molding, sintering to precision machining and post-processing.

Backed by deep expertise in high-purity ceramics and strong resource integration, our flexible custom services precisely meet customer needs from material selection to finished product delivery.