Name: Ceramic Quad Flat Package (CQFP) Manufacturers, Suppliers and Factory - Custom Service - Tessvida
Brand: Tessvida
SKU: 299596503

Ceramic Quad Flat Package (CQFP)

A versatile, high-reliability four-sided leaded package—the industry standard for achieving vacuum-tight integrity in complex systems.

The ceramic quad flat package (CQFP) is a precision-packaged component with four-sided pin arrangement, renowned for its lightweight, compact size, and high packaging density. In modern semiconductor applications, CQFP effectively protects internal sensitive components due to its excellent thermoelectric properties and is compatible with various high-density logic control modules.
Our products feature highly flexible lead pitch options, including standard specifications such as 1.27mm, 1.00mm, 0.80mm, 0.65mm, and 0.50mm, effortlessly meeting diverse wiring requirements. Whether for precision optocouplers, Hall effect sensors, or solid-state relays demanding high operational stability, the ceramic quad flat package (CQFP) delivers robust and dependable support.

Available materials: alumina, aluminum nitride, glass-ceramic composites, carbide alloys, tungsten-manganese or molybdenum-manganese thick-film metallization processes.
Applications: Semiconductor & Electronics, Medical Devices, Energy & Power, Equipment & Machinery

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Product Description

The ceramic four-side flat package (CQFP) is engineered for electronic applications requiring high SMT efficiency. Utilizing proven thick-film metallization and gold-soldering technologies, this package delivers exceptional gas tightness to prevent moisture and corrosion while maintaining signal integrity. To accommodate customized needs during product upgrades or maintenance, we provide flexible material options and sealing methods, offering a comprehensive ceramic packaging solution for signal processing and power control in demanding environments.

Features

Superior high-frequency signal integrity
High reliability with gas-sealed
Strong thermal cycling resistance
Compatible with advanced SMT processes
Radiation and aging resistance
Excellent electromagnetic compatibility (EMC)

High insulation performance
Low resistivity
Excellent corrosion resistance
High moisture resistance
Strong anti-electromagnetic interference capability
Low thermal expansion coefficient

Main Model Table (mm)

CQFP packaging offers a variety of material options including Alumina, Aluminum Nitride, and Kovar, complemented by precision thick-film metallization layers. Specifications cover a wide range of mainstream pitches from 1.27mm to 0.50mm, achieving a perfect combination of high reliability and high-density routing.

Product Model	Ceramic Body Size	Lead Pitch	Sealing Area	Die Attach Area	Total Thickness
Q18-01H	9.40×13.90	1.27	13.80×9.30	4.40×8.90	1.40

Ceramic Expertise

Tessvida is a Total Kit Solutions (TKS) specialist, serving key industries: semiconductor & electronics, medical devices, FPD/LED, machinery, petrochemicals, auto & Transportation, energy & power, and food & agriculture. With a mature supply chain and advanced processes (isostatic pressing, gel casting, dry pressing), we offer end-to-end capabilities from material preparation, molding, sintering to precision machining and post-processing.

Backed by deep expertise in high-purity ceramics and strong resource integration, our flexible custom services precisely meet customer needs from material selection to finished product delivery.