Name: Custom Ceramic Land Grid Array (CLGA) Manufacturers, Suppliers and Factory - OEM Service - Tessvida
Brand: Tessvida
SKU: 299597464

Ceramic Land Grid Array (CLGA)

High-density pad array providing exceptional electrical performance and precision CTE matching.

The Ceramic Land Grid Array (CLGA) package is designed for semiconductor. It features a bottom without protruding pins but instead uses neatly arranged pads for connection. This 'array' layout not only saves space significantly but also provides very stable electrical connections. Whether it's high-performance processors, controllers, or sensors and dedicated logic modules that require high reliability, the CLGA package can provide a safe, stable, and efficient working environment for the internal core components, thanks to its superior physical structure.

Available materials: alumina, aluminum nitride, high-temperature co-fired ceramic, tungsten-manganese, or molybdenum-manganese thick film metallization layers.
Applications: Semiconductor & Electronics, Medical Devices, Energy & Power, and Equipment & Machinery.

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Product Description

The leadless design of the Ceramic Land Grid Array (CLGA) package allows for faster signal transmission and less interference, making it suitable for high-speed electronic systems; the large, flat structure at the bottom can dissipate heat quickly, ensuring that the device does not overheat or downclocking during long-term operation. In addition, the package has a robust seal and good corrosion resistance. We rely on a standardized specification system to help customers accurately match various application size requirements, and support standardization based on samples to greatly simplify the selection process, helping products to be quickly matched and implemented.

Features

Leadless design reduces parasitic effects
Excellent planar thermal conductivity
Supports high-density interconnect and power integrity
Strong vibration resistance
High stability and aging resistance
High electrical insulation performance

Low resistivity
Good corrosion resistance
High moisture resistance
High electromagnetic interference (EMI) resistance
Low coefficient of thermal expansion (CTE)

Main Model Table (mm)

CLGA packaging offers Alumina, AlN, and HTCC substrates with precision thick-film metallization for stable performance. The full series features extensive standard specifications with diverse routing densities and cavity sizes to precisely match various application requirements.

Product Model	Ceramic Body Size	Lead Pitch	Sealing Area	Die Attach Area	Total Thickness
CLGA48-01	8.00×8.00	-	8.00×8.00	4.60×4.60	1.30

Ceramic Expertise

Tessvida is a Total Kit Solutions (TKS) specialist, serving key industries: semiconductor & electronics, medical devices, FPD/LED, machinery, petrochemicals, auto & Transportation, energy & power, and food & agriculture. With a mature supply chain and advanced processes (isostatic pressing, gel casting, dry pressing), we offer end-to-end capabilities from material preparation, molding, sintering to precision machining and post-processing.

Backed by deep expertise in high-purity ceramics and strong resource integration, our flexible custom services precisely meet customer needs from material selection to finished product delivery.