Name: Ceramic Quad Flat No-Lead (CQFN) Manufacturers, Suppliers and Factory - Custom Service - Tessvida
Brand: Tessvida
SKU: 299597298

Ceramic Quad Flat No-Lead (CQFN)

Compact leadless design with ultra-low inductance, ideal for RF and high-frequency applications.

The ceramic four-side no-pins package (CQFN) is a hallmark of miniaturization in semiconductor packaging. It replaces conventional long pins with a direct connection via a bottom pad, enabling a compact and lightweight design while optimizing signal transmission.
The ceramic four-side pinless package is designed for precision equipment with limited space, supporting high-speed AD/DA converters, DDS frequency synthesizers, and other components. It also finds applications in critical modules such as surface acoustic wave devices, RF, and microwave systems. Additionally, for Hall effect devices, miniature optocouplers, and highly integrated discrete units, the CQFN serves as a reliable protection carrier.

Available materials: alumina, aluminum nitride, low-temperature sintered ceramics, high-temperature sintered ceramics, tungsten-manganese or molybdenum-manganese thick-film metallization.
Applications: Semiconductor & Electronics, Medical Devices, Energy & Power, Equipment & Machinery

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Product Description

The ceramic four-side no-pins package (CQFN) is designed for compact size and high performance. Its no-pins design effectively reduces parasitic interference, ensuring stable operation in high-frequency signal environments such as RF and microwave applications, making it an ideal choice for high-speed circuit packaging. Crafted from high-performance ceramic material, the package features rapid heat dissipation, high-temperature resistance, and superior air-tight protection to effectively resist external moisture and corrosion, enabling long-term stable operation of internal core components. Additionally, the product offers excellent compatibility with PCB boards, easy installation, and outstanding durability. We provide comprehensive solutions from material selection to structural design, professionally addressing various electronic packaging challenges.

Features

Superior high-frequency impedance control capability
Low thermal resistance path
Lead-free structure eliminates parasitic resonance
High reliability with air-sealed packaging
Excellent CTE matching
Supports high-density interconnects and integration

High insulation performance
Low resistivity
Excellent corrosion resistance
High moisture resistance
Low thermal expansion coefficient

Main Model Table (mm)

CQFN packaging offers material options including HTCC, LTCC, Alumina, and Aluminum Nitride, featuring professional thick-film metallization to ensure superior solder strength and conductivity.

Product Model	Ceramic Body Size	Lead Pitch	Sealing Area	Die Attach Area	Total Thickness
CQFN72-01	10.00×10.00×1.50	0.5	9.80×9.80	6.40×6.40	1.5

Ceramic Expertise

Tessvida is a Total Kit Solutions (TKS) specialist, serving key industries: semiconductor & electronics, medical devices, FPD/LED, machinery, petrochemicals, auto & Transportation, energy & power, and food & agriculture. With a mature supply chain and advanced processes (isostatic pressing, gel casting, dry pressing), we offer end-to-end capabilities from material preparation, molding, sintering to precision machining and post-processing.

Backed by deep expertise in high-purity ceramics and strong resource integration, our flexible custom services precisely meet customer needs from material selection to finished product delivery.