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Aluminum nitride (AlN) ceramics are inorganic non-metallic materials primarily composed of aluminum nitride as the main crystalline phase. The key characteristic of aluminum nitride ceramics is their excellent thermal conductivity, which is significantly higher than that of traditional ceramics such as alumina. This property allows for effective heat dissipation from electronic components, maintaining the stability of the equipment. Additionally, aluminum nitride ceramics exhibit good electrical insulation, mechanical strength, low dielectric constant and dielectric loss, stable chemical properties, non-toxicity, high-temperature resistance, and a low coefficient of thermal expansion.
- High thermal conductivity
- Low expansion coefficient
- Excellent electrical properties (dielectric constant, dielectric loss, bulk resistivity, dielectric strength).
- Good mechanical properties
- Good optical transmission characteristics
- Non-toxic
- High hardness
- Resistant to heat and molten metal
Aluminum Nitride Properties
|
Material Matrix |
Aluminum Nitride |
|||
|
Properties |
Item |
Unit |
AN100A |
AN180 |
|
Physical Property |
Content |
% |
- |
- |
|
Colour |
|
Milky White |
Greyish White |
|
|
Density |
g/cm3 |
3.2 |
3.3 |
|
|
Mechanical Behavior |
Vickers Hardness |
GPa |
11.2 |
10.5 |
|
Bending Strength |
Mpa |
220 |
320 |
|
|
Compressive Strength |
Mpa |
450 |
- |
|
|
Young's Modulus |
GPa |
310 |
320 |
|
|
Poisson's Ratio |
/ |
0.24 |
0.24 |
|
|
Fracture Toughness |
Mpa.m1/2 |
3.2 |
3.3 |
|
|
Thermal Property |
Coefficient of Thermal Expansion |
10-6/°C |
4.6 |
4.6 |
|
Thermal Conductivity |
W/(m.K) |
120 |
180 |
|
|
Specific Heat Capacity |
J/(g.K) |
0.72 |
0.72 |
|
|
Maximum Operating Temperature |
°C |
800 |
800 |
|
|
Electrical Property |
Dielectric Strength |
kv/mm |
16 |
16 |
|
Dielectric Constant (1MHz) |
- |
8.5 |
8.6 |
|
|
Dielectric Losses (1MHz) |
(X10-4) |
2 |
3 |
|
|
Volume Resistivity 20℃ |
Ω.cm |
>1014 |
>1014 |
|
|
Volume Resistivity 300℃ |
Ω.cm |
1011 |
1010 |
|
* The listed property values are average results obtained from test samples and are not guaranteed. Please be aware that these values may vary for specific production batches.
Aluminum Nitride Applications in Various Industries
- Thermal Management Materials: Aluminum nitride possesses extremely high thermal conductivity, making it an ideal material for heat dissipation. It is widely used in heat sinks for electronic devices such as computer CPUs and in thermal substrates for power amplifier modules.
- Electronic Packaging Materials: Aluminum nitride can be used to encapsulate semiconductor devices, helping to protect chips from external environmental interference while effectively dissipating heat.
- Ceramic Substrates: It can serve as a carrier for various electronic components, utilized in the manufacturing of multilayer ceramic capacitors, thick-film circuits, and more.
- Electronics Industry: In the manufacturing process of electronic chips, aluminum nitride ceramic nozzles are employed in applications such as photoresist spraying and electronic cleaning fluid spraying. Their high thermal conductivity and electrical insulation properties ensure precise spraying and the safety of the equipment.
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