SEMICON® West 2026 took place from October 13–15 in San Francisco, USA, bringing together global semiconductor industry leaders to explore the latest trends in AI, advanced packaging, and semiconductor manufacturing.
Tessvida showcased its advanced materials and precision components solutions, connecting with customers and industry partners from North America and beyond. Throughout the three-day event, our team engaged in productive discussions with semiconductor manufacturers, equipment suppliers, and companies across the medical and new energy sectors, exploring potential collaboration opportunities.
Highlighting Our Core Solutions
1. Advanced Ceramic Precision Components
Including alumina ceramic arms, vacuum wafer chucks, ceramic rings, porous ceramic plates, and ceramic domes. These components offer excellent plasma resistance, thermal stability, and precision, meeting the demanding requirements of semiconductor manufacturing.
2. Total Kit Solutions (TKS) & Surface Treatment Services
Providing one-stop solutions covering design, prototyping, volume production, spare parts refurbishment, precision cleaning, and surface treatment services for semiconductor, medical, and new energy applications.
Moving forward, Tessvida remains committed to delivering reliable advanced materials and precision manufacturing solutions, supporting customers worldwide with comprehensive sourcing and supply chain services.
Thank you to everyone who visited us at SEMICON® West 2026! We look forward to building more successful partnerships.
For product inquiries or technical information, please contact us:
Email: info@tessvida.com
Tel: +65 80391374
